发明名称 RESIN COMPOSITION FOR PLATING
摘要 PURPOSE:To provide the titled compsn. yielding plating films excellent in thermal cycling resistance and peeling strength, by incorporating three particular copolymers with an org. silicon compd. CONSTITUTION:15-75pts.wt. polybutadiene latex, 5-95pts.wt. graft copolymer in which an arom, monovinyl monomer (a) and a vinyl cyanide monomer (b) are partially grafted onto said polybutadiene latex, 100pts.wt. mixture of 95-5pts.wt. graft copolymer in which the component (a) and the component (b) are partially grafted onto 15-75pts.wt. styrene/butadiene copolymer latex having the content of styrene of 5-45pts.wt. with 0-85pts.wt. copolymer of 50-85pts.wt. component (a) and 50-15pts.wt. component (b), and 0.01-0.5pts.wt. org. silicon compd. having a viscosity at 25 deg.C of 10-100,000cst, a surface tension of 0.25wt% soln. in toluene at 25 deg.C of 26.5dyne/cm or less, and a repeating unit of the formula (wherein R1-2 are H, alkyl, aralkyl, carboxymethyl; n is 1 or above) are incorporated.
申请公布号 JPS61120845(A) 申请公布日期 1986.06.07
申请号 JP19840240442 申请日期 1984.11.16
申请人 TORAY IND INC 发明人 IWAMOTO MASATOSHI;TAGUCHI TAKASHI;SATO HIROSHI;KISHIMOTO AKIHIKO
分类号 C08L51/00;C08L7/00;C08L21/00;C08L25/00;C08L25/12;C08L33/00;C08L33/02;C08L51/02;C08L51/04;C08L55/00;C08L55/02;C08L83/04;C23C18/20;C25D5/56 主分类号 C08L51/00
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