| 摘要 |
PURPOSE:To form easily a metallic plating layer of a desired pattern on the surface of a polyester resin molding by forming a masking layer consisting of a vinyl chloride/vinyl acetate copolymer on the surface of said molding then depositing a required metal thereon by electroless plating and dissolving away the masking agent. CONSTITUTION:The surface of a polyester resin circuit board, etc. is first physically or chemically etched in the stage of producing the printed circuit substate, etc. consisting of a polyester resin by electroless plating. The masking agent consisting of the following compsn. is then coated on the surface thereof by screen printing, etc. to a desired pattern: The masking agent prepd. by dissolving the vinyl chloride/vinyl acetate copolymer consisting of 90-98% vinyl chloride and 2-10% vinyl acetate in an org. solvent such as toluene or methanol at 5-20% concn. is used. The required metal such as Cu or Ni is then electroless- plated on the surface and thereafter the masking agent is dissolved away by an org. solvent, by which the plating layer is formed to the desired pattern. |
