| 摘要 |
<p>PURPOSE:To obtain a semiconductor device which has excellent heat resistance, chemical resistance and weather resistance, high mechanical strength and good appearance by providing a package having an alumina ceramic layer formed by plasma flame coating on the external surface of a resin ring. CONSTITUTION:A semiconductor pellet 30 is contained in a package 34 which has an alumina ceramic layer 33 formed by plasma flame coating on the external surface of a resin ring 32 which has apertures at both the ends. The both apertures of the package 34 are closed by a sealing metal 35 attached to press on the second reinforcing plate 31b on the semiconductor pellet 30. The alumina ceramic layer 33 is formed, e.g., by making the external surface of the resin ring 32 coarse blasting alundum grinding powder of grain size approx. 80 by 3-5kg/cm<2> air pressure, so-called sandblast treatment, and by flame-coating the coarse surface with alumina ceramic minute powder of grain diameter 10-50mum and composition of Al2O3 99%.</p> |
