| 摘要 |
The subject of the present invention is a method and a device for encapsulating integrated circuits. This method comprises the following stages: a. Introducing the integrated circuit 1 into the cavity 9 of a two-part mould 7; b. Closing the mould; c. Injecting into the mould a thermoplastic resin, for example PPS, whose shear viscosity at the injection temperature T is between 10 and 100 Pa.s; and d. Removing the encapsuled circuit from the mould after cooling and hardening of the resin. By virtue of this method the encapsulation operation can be carried out at the rate of a production line for integrated circuits. <IMAGE> |
