| 摘要 |
PURPOSE:To remove any needless mold film efficiently and perfectly by a method wherein the swelling of mold film on molded lead frames in cassettes is accelerated and then the molded lead frames together with the cassettes are sprayed with high speed jet water stream upward and downward. CONSTITUTION:Rails 12, 12' are provided in a bath 13 containing alkali solution and then an endless chain 14 is stretched utilizing sprockets 15, 15' as shown in figure and then cassettes mounted on the left side of figure are fed one by one to 50 deg.C alkali bath 13 to be forwarded on the rails 12, 12'. Electrodes 17, 18 are provided opposing to the belt and cassettes and then direct current is supplied between the cassettes rails 12, 12' and the electrodes 17, 18 to electrolyze lead frames in the cassettes. Then lead frames together with cassettes are discharged right-ward in the figure. When the lead frames are sprayed with jet water stream of 20kg/cm<2>-60kg/cm<2> upward and downward, any needless mold film may be perfectly removed after providing semiconductor with perfect finish plating without any abnormality in the semiconductor. |
