| 摘要 |
<p>1,193,945. Splitting stone. R.C.A. CORPORATION. 12 Feb., 1969 [23 Feb., 1968], No. 7610/69. Heading B5E. [Also in Division H1] A scribed semi-conductor wafer 10 is mounted between two flexible diaphragms 36, 38, e.g. of rubber, and a force is exerted against the diaphragm 36 in contact with the unscribed face to flex the diaphragm and the wafer into an arched configuration and thus to break the wafer along the scribed lines. In the apparatus shown the flexing occurs into a cavity 28 of a lower block 24 under the action of excess air pressure introduced into a cavity 26 in an upper block. Reverse flexing may also occur if means are provided for subsequently applying excess air pressure to the cavity 28, this being particularly useful when the unscribed face of the wafer 10 has a metal covering, e.g. of lead. In an alternative apparatus the wafer is mounted, scribed face down, between two aluminium foils and two spring steel diaphragms over a cylindrical groove (52), Fig. 7 (not shown) in a block (51). A brass cylinder (64) is used to urge the resulting sandwich down into the groove (52), breaking the wafer along the scribed lines parallel to the groove axis. The procedure is repeated with the wafer turned through 90 degrees to break it along the other set of scribed lines.</p> |
