| 摘要 |
PURPOSE:The titled adhesive, obtained by adding an inorganic filler treated with a specific organic compound to an adhesive for additive plating, and having improved adhesion of a metal film to an adhesive layer, heat resistance and processability. CONSTITUTION:An adhesive obtained by adding an inorganic filler treated with an organic compound, e.g. caproic acid, having one or more groups of (C)OH, COOH, C(O)R, NH2, NRH to an adhesive for additive plating prepared by incorporating (A) a synthetic rubber with (B) a curable resin, e.g. epoxy resin. Preferably, the compounding ratios of the components are as follows; 30-70wt% component (A), 70-30wt% component (B) and 1-30wt%, based on the solid adhesive content, component (C). |
