发明名称 CHIP CARRIER PACKAGE
摘要 PURPOSE:To offer the titled package with leads which is suitable for visually inspect solder wetting after soldering, by providing leads with gaps. CONSTITUTION:The inner surface of a lead 2 is provided with a gap 3 in the longitudinal direction. When solder 6 deposited on a conductive pattern 5 dissolves, the solder becomes wet to the lead part 2 of the titled package with leads, and thereby the solder 6 wets the lead part 2 by a distance of about 0.5mm or 1mm off its contact surface with the conductive pattern 5. At this time, dissolved solder keeps on filling the gap 3 in the arrow direction by capillary action. In other words, in case of sufficient solder wetting, the gap 3 is filled with solder; therefore, solder wetting can be easily confirmed by visual inspection.
申请公布号 JPS61117857(A) 申请公布日期 1986.06.05
申请号 JP19840238375 申请日期 1984.11.14
申请人 HITACHI LTD 发明人 YONEDA YUTAKA
分类号 H05K1/18;H01L21/48;H01L23/495;H01L23/50;H05K3/34 主分类号 H05K1/18
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