| 摘要 |
A pressure difference measuring device having a semiconductor pressure sensor in a pressure pickup body which supports at each end face thereof a separating diaphragm with an adjacent supplemental diaphragm. On both sides of the semiconductor pressure sensor, a connecting canal is provided which leads in spur canals to the separating diaphragms and the supplemental diaphragms. In order to equip a pressure difference measuring device of this type with mechancial damping without adverse consequences for the operation of the overload protection, a damping element is arranged in at least one connecting canal. An equalizing diaphragm is associated with the semiconductor pressure sensor, the two sides of which are connected by the connecting canals in the region between the semiconductor pressure sensor and the damping element. |
