| 摘要 |
PURPOSE:To prevent the abnormal increase of temperature of the titled device by alleviating the variation in thermal resistance in this device by controlling the thickness of a thermal conductive adhesive which loads a heat dissipator to a wiring board. CONSTITUTION:The bottom of the wiring board 1 is loaded with the heat dissipator 2 via thermal conductive adhesive 5. Conductors 3 to install solder spacers are formed at both ends of the adhesive 5. When solder is put thereon and heated, solders 4 serving as the spacers are connected. Besides, the solders 4 are in contact with heat dissipating fins 2. The height of the solder 4 is determined by the shape and area of the conductor 3 and by the amount of printed solder and can be easily controlled. The height of the spacer 3 is controlled within a certain range. Such a control of the thickness of the thermal conductive adhesive 5 can alleviate the variation in thermal resistance of the hybrid IC. This can prevent the abnormal increase of temperature of said IC. |
