发明名称 MANUFACTURE OF SEMICONDUCTOR DEVICE
摘要 PURPOSE:To diffuse and weld metallic bumps completely by a method wherein the second active layer is arranged on the first active layer after adjustment and a bumping metallic block having parallel flat planes is laminated on them and a movable supporting member presses and heats them through a hard ball. CONSTITUTION:The first and second active layers 101 and 201 are brought in contact with each other after adjustment of the bumps are put on a fixed supporting member 301. A surface of the supporting member made of Fe and etc. is finished flatly and it is tightly in contact with a back side of the active layer 101. The overall surface of back side of the active layer 201 is covered with a bumping block 302 made of Fe and etc. whose sides are finished flatly and parallel, on which a hard ball 303 made of Fe is put and a contact point is determined in the vicinity of the center of the active layer 201. From the above of said hard ball 303, a pressure and a heat are applied (a pressing device 305) through a movable supporting member 304. By this constitution, the ball 303 and the plane 302 are in contact at one point so that a direction of pressure is corrected to be vertical to the layer 201 and the stress of the plane 302 and the ball 303 concentrated in the contact point is dispersed uniformly on the contact plane of the block 302. Accordingly, the metallic bumps of the surfaces of active layers are diffused and weld uniformly.
申请公布号 JPS61116849(A) 申请公布日期 1986.06.04
申请号 JP19840237915 申请日期 1984.11.12
申请人 NEC CORP 发明人 YASUMOTO MASAAKI;ENOMOTO TADAYOSHI
分类号 H01L21/60;(IPC1-7):H01L21/60 主分类号 H01L21/60
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