| 摘要 |
PURPOSE:To prevent a solder from flowing out by providing a through hole at a portion connected with an electrode. CONSTITUTION:A through hole 21a is formed at the end of the lead piece 21 of a lead frame provided on a carrier tape 1. The hole 21a is formed smaller than a projecting electrode 31 on a semiconductor chip 3. The portion of the hole 21a is contacted with the electrode 31 to be heated, thereby bonding the piece 21 with the electrode 31 by a solder layer, and an excess solder layer 21a is collected in the hole 21a to eliminate the flow of the solder to the edge of the chip 3. Accordingly, a shortcircuit defect when the lead frame is bonded can be prevented. |
