发明名称 BOTH-SURFACE POLISHING APPARATUS
摘要 PURPOSE:To facilitate the mounting of a workpiece by differentiating each contact area of the polishing cloths of the upper and lower surface plates for the workpiece, in a both-surface polishing apparatus which relatively revolves and transfers the upper and lower surface plates and a carrier. CONSTITUTION:When a workpiece 6 held onto a carrier 5 is polished, the workpiece 6 is nipped under pressure between the polishing cloths 13 and 11 of the upper and lower surface plates 3 and 1, and the both surfaces are polished through the relative revolution and transfer. When polishing is completed, the upper surface plate 3 is raised, and the workpiece 6 is demounted. Since a plurality of holes 12 are drilled onto the polishing cloth 11 of the upper surface plate 3, a difference is generated between each contact area of the both polishing cloths 13 and 11 for the workpiece 6. In other words, the surface tension between the polishing cloth 11 and the upper surface of the workpiece 6 becomes larger than the surface tension between the polishing cloth 13 and the undersurface of the workpiece 6, and all the workpiece 6 are left on the polishing cloth 13 of the lower surface plate 1. Therefore, demounting is facilitated, and also automatic demounting is permitted.
申请公布号 JPS61117064(A) 申请公布日期 1986.06.04
申请号 JP19840240225 申请日期 1984.11.14
申请人 TOSHIBA CORP;TOSHIBA CERAMICS CO LTD;TOSHIBA MACH CO LTD 发明人 KINOSHITA MASAHARU;KAWAKAMI HIDEO;TAZAWA SHINICHI;ENDO MASAMI
分类号 B24B37/12;B24D5/00;B24D11/02 主分类号 B24B37/12
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