| 摘要 |
<p>PURPOSE:To obtain the laminate with copper lining excellent in heat resistance of solder at high temperature and adhesion property between a metallic plate and resin by a method in which the metallic plate mechanically polished is coated with amino family silane coupling solution, and then copper foil is laminated on said plate with polyimide resin layer intervening there between. CONSTITUTION:The metallic plate mechanically polished (preferably aluminum plate) is coated with the solution of aminofamily silane coupling agent (preferably (R)-aminopropyl triethoxy silane). After its drying, copper foil (preferably the electrolytic copper foil treated with silane coupling agent) is laminated on said plate with the polyimide resin layer (preferably glass fabric base material impregnated with polyimide resin, etc.) intervening there between. The plate is heated, pressurized and cured, whereby the objective laminate is obtained. EFFECT:The peel strength of a copper foil in high at high temperature USE:Printed circuit board, etc.</p> |
