| 摘要 |
PURPOSE:To obtain the smooth cut surface and improve cutting efficiency by carrying-out cutting work by traveling a cutting wire at a high speed in one direction from the start of cutting to the end, in cutting a semiconductor material, etc. into wafer form. CONSTITUTION:A cutting wire 2 supplied from a driving-out reel 3 is wound a certain interval onto three grooved rollers 5 through an inlet-side capstan 8-1 and a tension generator 7-1, and taken-up onto a taking-up reel 4 through an outlet-side tension generator 7-2 and a capstan 8-2. The wire tension is controlled by revolution-speed controllers 11-1, 9-1, and 9-2. While, a member 1 to be cut is raised by an elevator, and cut into a number of wafers at a same time by a wire group 2-1 supplied in one direction at a high speed by a wire feeding-speed controller 6. When a new member is to be cut, the feeding direction of the cutting wire 2 is switched to the reverse direction, and high- speed feed is carried-out. |
