| 摘要 |
A corrosion-protective coating comprises in adherent contact (i) an electrolytically deposited Nicontaining P-free lower layer, (ii) an intermediate layer of Ni-P alloy which may be deposited electrolytically or by electroless deposition, and (iii) an electrolytically deposited Nicontaining P-free upper layer, the intermediate layer being anodic relative to the upper and lower layers, i.e. more easily corroded. The Ni-Palloy may include 0.4 to 10% by weight of P. Each of the layers may contain Co, e.g. the lower, intermediate and upper layers respectively containing 0-25%, 0-25% and 0-50% by weight. The Ni-P layer may include minor amounts of S, Se, Te and As. The lower and upper layers may contain respectively less than 0.15% and 0-0.3% of S. The upper Ni layer may be electro-plated with Cr. Specified substrates are of Fe, steel, Cu, Zn, Al, Mg and alloys thereof. The substrate may have a Cu strike thereon. The Ni may be plated from a solution containing at least one of the following salts: nickel sulphate, chloride, fluoborate and sulphanate. Where Ni-Co alloy is to be plated, the Co may be included in the solution as cobalt chloride, bromide or sulphate. Buffers such as boric acid, acetic acid, borax, formic acid or fluoborates and wetting agents, e.g. of the sulphate type, may be used. The lower and upper layers of Ni may be deposited from baths containing one or more brighteners of a first class (a sulpho-oxygen carrier). These compounds may comprise an aryl ring, a substituted aryl ring or an unsaturated aliphatic chain with a sulphur containing radical in the form of sulphonic acids, sulphonates, sulphonamides, sulphimides, sulphinic acid or sulphones. These baths may in addition contain brighteners of a second class including organic compounds where the brightening action depends on the carbonyl, ethylenic or acetylenic radicals, azo or azine type nuclei or on the cyano or thioureide radicals. The Ni-P alloy plating baths may contain the P as <FORM:1081793/C6-C7/1> where n is O or 1, m is O or 1 and R represents H, an alkali metal, Ni, Co, or an alkyl, aralkyl, aryl or alkaryl radical. Specified P compounds include phosphorous acid, organic phosphonic, hypophosphorous, organic phosphinic, organic phosphonous and organic phosphinous acids and their derivatives. For electroless plating with Ni-P, hypophosphite baths are mentioned. Many specific examples are given of solutions and plating conditions. |
