| 摘要 |
<p>A method and composition for forming electrically conductive termination films on ceramic capacitor bodies having improved adhesion and solder leach resistance wherein a mixture of a palladium resinate and a base metal resinate or oxide is deposited on the opposite end faces of the capacitor body. The deposit is fired at 700 DEG - 1100 DEG C to pyrolyze the resinate moiety of the metal resinates, whereby palladium and base metal oxide residues are formed on the end faces of the capacitor. The residues catalyze the depositon of nickel from nickel plating baths to prepare solder leach resistant end faces.</p> |
