| 摘要 |
PURPOSE:The titled composition having low stress and excellent moisture resistance, prepared by mixing an epoxy resin with a curing agent and a specified polyphosphazene. CONSTITUTION:An epoxy resin such as bisphenol A or novolak type is mixed with 0.5-5wt% polyphosphazene having a recurring unit of the formula (wherein R is amino, alkylamino, arylamino, hydroxyalkyl, epoxy, carboxyl or carboxyalkyl), a curing agent (e.g., phenol novolak resin) and, optionally, a cure accelerator, inorganic filler, mold release, colorant, surface treating agent, flame retardant, etc.
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