| 摘要 |
<p>PURPOSE:To enable to use a laser welding machine even for a package having a complicated shape by gold plating a part to be welded to the semiconductor of a base and plating with nongloss on the part to be welded to the can member of the base and the outer periphery in the vicinity of the part. CONSTITUTION:A lower plating layer is formed on the base material 4, and the gold is plated thereon. The can 10 is formed by plating nickel on a material such as kovar, and nonglossy plating is conducted without gold plating on the part superposed with the base 1 and the outer periphery 11 of the base. Since the nonglossy plating is conducted in this manner, even the package having complicated shape can not almost reflect the laser light, but can efficiently absorb it. Accordingly, hermetic seal can be conducted by using the laser welding machine, and welding locus can be controlled.</p> |
