发明名称 SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE AND PATTERN LAYOUT THEREFOR
摘要 PURPOSE:To provide via contact holes with less positional errors by a method wherein the center line of a via contact hole is made to be in line with the center line of a wiring layer formed on a substrate. CONSTITUTION:An Al wiring 36a runs over a cell row 312 and its end is connected to an end of an Al wiring 34c in a wiring region 332 through a via contact hole 38. Under the via contact hole 38, a wiring layer 35b is located. A pattern is laid out wherein the center line of the wiring layer 35b coincides with the center line of the via contact hole 38.
申请公布号 JPS61114551(A) 申请公布日期 1986.06.02
申请号 JP19840235192 申请日期 1984.11.09
申请人 TOSHIBA CORP 发明人 KONDO HITOSHI;SUEDA AKIHIRO
分类号 H01L21/3205;H01L21/768;H01L21/82;H01L23/522;H01L23/535 主分类号 H01L21/3205
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