发明名称 |
SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE AND PATTERN LAYOUT THEREFOR |
摘要 |
PURPOSE:To provide via contact holes with less positional errors by a method wherein the center line of a via contact hole is made to be in line with the center line of a wiring layer formed on a substrate. CONSTITUTION:An Al wiring 36a runs over a cell row 312 and its end is connected to an end of an Al wiring 34c in a wiring region 332 through a via contact hole 38. Under the via contact hole 38, a wiring layer 35b is located. A pattern is laid out wherein the center line of the wiring layer 35b coincides with the center line of the via contact hole 38. |
申请公布号 |
JPS61114551(A) |
申请公布日期 |
1986.06.02 |
申请号 |
JP19840235192 |
申请日期 |
1984.11.09 |
申请人 |
TOSHIBA CORP |
发明人 |
KONDO HITOSHI;SUEDA AKIHIRO |
分类号 |
H01L21/3205;H01L21/768;H01L21/82;H01L23/522;H01L23/535 |
主分类号 |
H01L21/3205 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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