| 摘要 |
<p>PURPOSE:To realize a resin seal type EPROM device by not only loading an EPROM chip onto a lead frame but also padding an ultraviolet transmitting resin on the chip and mounting a plate-shaped ultraviolet transmitting window member onto the resin. CONSTITUTION:A lead frame 21 has an element loading section 22 plated with gold or silver after processing and a plurality of external leading-out terminals 23 similarly plated with gold or silver after processing in post sections as ends on the element loading section 22 side. An EPROM chip 24 is die-bonded onto the element loading section 22 for the lead frame 21 by Ag paste, etc. An ultraviolet transmitting resin 26 is padded onto the EPROM chip 24, and a plate- shaped ultraviolet transmitting window member 27 is mounted in parallel with the surface (an ultraviolet-ray projecting surface) of the EPROM chip 24 on the ultraviolet transmitting resin 26.</p> |
