| 摘要 |
PURPOSE:To obtain a low contact resistance of the same level as a soldered article without soldering, by affixing a projecting electroconductive substance of copper or the like to a copper-leaf tape. CONSTITUTION:A projecting electroconductive substance 11 of copper or the like, which is shaped in a cone, a semicolumn or the like, is fixed beforehand to an upper-layer copper leaf 6 of a lapping portion by soldering or the like in such a state that the contact resistance thereof is zero. The electroconductive substance 11 itself may be a solder. When the copper-leaf tape thus prepared is superposed, the electroconductive substance 11 contacts with a lower-layer copper leaf 6. The contact point thereof is firmly fixed in a physical manner from the surroundings by the adhesion of an adhesive for the copper leaves, and a low contact resistance of several milliohms is obtained. The height, outside diameter and width of the electroconductive substance 11 are set in optimum dimensions in accordance with the width and length of the lapping portion of the copper leaves. |
