| 摘要 |
<p>PURPOSE:To realize a resin seal type EPROM device by not only loading an EPROM chip onto a lead frame but also using a scaffold-shaped ultraviolet transmitting window member and interposing an ultraviolet transmitting resin between an upper plate in the window member and the EPROM chip. CONSTITUTION:A lead frame 21 has an element loading section 22 plated with gold or silver after processing and a plurality of external leading-out elements 23 similarly plated with gold or silver after processing in post sections as ends on the element loading section 22 side. An EPROM chip 24 is die-bonded onto the element loading section 22 for the lead frame 21. A scaffold-shaped ultraviolet transmitting window member 26 is spanned and fitted onto the EPROM chip 24 to which wirings are conducted. A beltlike plate 29 is shaped in length longer than the pitch of the external leading-out terminals 23 so that the plate 29 does not slip off or does not incline even when it is positioned in an air gap between the external leading-out terminals 23 at that time.</p> |
