| 摘要 |
PURPOSE:A resin composition curable in an extremely short time by ultraviolet light irradiation, providing a cured material having improved moistureproof electrical insulating properties and thermal shock resistance, obtained by blending specific amounts of specified components such as an ultraviolet-curing epoxyacrylate resin, cobalt naphthenate, etc. CONSTITUTION:100pts.wt. base resin consisting of an ultraviolet-curing epoxy acrylate resin is blended with 0.02-0.5pts.wt. cobalt naphthenate, 0.1-5pts.wt. aminosilane coupling agent, and 0.1-3pts.wt. methyl ethyl ketone peroxide, to give the aimed resin composition. The substrate 1 for electric circuit equipped with the electronic part 4 with the solder 3 is coated with the resin composition 2, and irradiated with ultraviolet rays, so the resin composition at the space part 7 sandwiched in between the electronic part 4 and the substrate 1 is cured in an extremely short time. Consequently, deterioration in insulation resistance will not occur even at high temperature, at high humidity.
|
