| 摘要 |
PURPOSE:To improve the electric characteristics by means of minimizing the inductance component due to wiring of transistor element by a method wherein a square conductor electrically connecting a transistor element to a circuit element is fixed in a recession formed in a substrate body. CONSTITUTION:A substrate body is composed of a substrate 1 formed of a metallic film 1a, 1c and recession 1d between the metallic films 1a and 1c as well as a radiating fin 2. The surface and backside of a copper-made square conductor 12 fixed in the recession 1d are respectively soldered with a condenser 8 and the radiating fin 2. In such a constitution, the inductance component of square conductor 12 may be almost negligible since an emittance electrode of transistor element 5 is connected to one electrode of the capacitor 8 through the intermediary of a bonding lead 9 and the square conductor 12. Through these procedures, the electric characteristics may be improved remarkably due to less emitter inductance component in the transistor element 5 and no loss in high frequency signals. |
