| 摘要 |
PURPOSE:To seal a light-emitting device having excellent solder resistance, damp-proofing and heat resistance efficiently by a photo-setting resin in a short time by burying a light-emitting element by a photo-setting type resin composition, irradiating a burying resin section by beams condensed by a reflective surface and curing and sealing the photo-setting type resin. CONSTITUTION:A resin-sealed LED1 is hung from an upper section, an ultraviolet-ray lamp 2 is fitted to the upper section of the LED1, a reflective surface 3 is formed to the upper section of the ultraviolet-ray lamp 2 and a reflective surface 3' to the lower section of the LED1, and a resin section 4 in the resin-sealed LED1 is automatically forwarded continuously to a section in the vicinity of the beam-condensing point of ultraviolet beams. An infrared- ray or far infrared-ray lamp can also be combined in place of the ultraviolet-ray lamp as the assistance of heating. An acrylic group resin, a radical-setting group resin such as unsaturated polyester, a cation polymerization group epoxy resin, etc. can be cited as a photo-setting type resin composition. |
