| 摘要 |
PURPOSE:To expand the freedom of solder selection by fixing a light emitting element and an optical fiber opposed to the light emitting element respectively on a carrier forming a through hole with solder. CONSTITUTION:The light emitting element 1 is joined through solder 2a on the carrier 3 joined with a package 4 through solder 2b, solder 2c is mounted on the surface of the carrier 3 and heated and melted so that an optical fiber 5 is embedded in the solder 2c, and then the fiber 5 is positioned and fixed so that optical coupling efficiency for the light emitting element 1 is improved. Since a round hole 6 is arranged on the lower side of the solder 2c, heat for melting the solder 2c is reduced near the round hole 6 to suppress the transmission of other heat. Even if the melting point of the solder 2c is slightly higher than that of the solders 2a, 2b, the freedom of solder selection can be expanded. |
