| 摘要 |
PURPOSE:To prevent the diffusion of bump soft solder out of a junction to the periphery by a method wherein a chip is bonded with bumps to the connection seat formed on a junction wiring made of conductive metal which does not fit to soft solder. CONSTITUTION:The junction wiring 11 is made of a conductive metal such as titanium or chromium which is excellent in adhesion with an insulation substrate 3 and does not fit to soft solder. A connection wiring 12 is made of Au or the like, a conductive metal which fits to soft solder and is resistant to corrosion. The connection wiring 12 is provided with circular connection seats 12a at parts corresponding to the bumps 2 of a chip 1, which is mounted via bumps 2 on these connection seats 12a and bonded to these pieces 12a by the fusion of the bumps 2 on heating. The device thus constructed prevents the horizontal diffusion and flow of solder of the bumps 2, in actual use, because of the exposure of the junction wiring 11 plane around the connection seats 12a. |
