| 摘要 |
PURPOSE:To contrive the reduction in cost of the title device by reducing the used amount of Au by a method wherein the Au-plating thickness of the inner lead part is made smaller than that of the tab. CONSTITUTION:The thickness of Au plating 1 on the tab 2 of a lead frame is 1.5mum or more, while the thickness of Au plating 1 at the inner lead part 3 is smaller 0.3-1.0mum. Such a manner produces no possibility of pellet cracks caused by the leakage failure of an Au-Si eutectic crystal 5 and makes no problem in stripping of Au wires 6 of the inner lead part 3 from contact bonding parts 7. Besides, when the Au plating thickness is 1.5mum or more only at a pellet adhesion part 1a, and the plating 1 thickness of the tab part 1b and the inner lead part 3 is 0.3-1.0mum, then similarly no problem generates. Such a manner enables the large reduction in cost of the title device by reducing the used amount of Au plating. |
