Cooling apparatus for semiconductor device

摘要

A cooling apparatus for a semiconductor device 1 comprising a metallic block 2 to which the semiconductor device is attached, which can serve as a heat sink for the semiconductor device and which has at least one coolant receptacle 3A formed therein, at least one pipe 45 which is mounted on said metallic block and which has a space portion communicating with said coolant receptacle thereby forming a heat pipe, and means for cooling said pipe.