| 摘要 |
PURPOSE:To give acid resistance to adhered boundary layer between Cu foil and supporting substrate, by forming covering layer composed of Zn and Ni having a specified structure on the surface of Cu foil, heating and adhering pressedly Cu foil to stick it to supporting substrate with each other, and changing covering layer of binary alloy to ternary alloy composed of Zn, Ni, Cu. CONSTITUTION:Binary alloy composed of, by weight %, 95-20 Zn, 5-80 Ni is electrodeposited to the surface of Cu foil, to form covering layer having 0.001-0.15mu thickness. The Cu foil is heated to about 170 deg.C, and stuck pressedly to supporting substrate by about 20kg/cm<2> pressing force for about 1hr, and covering layer of binary alloy is changed to ternary alloy composed of Zn, Ni, Cu. |
