| 摘要 |
<p>PURPOSE:To simplify and secure the process of positioning, and to offer MMIC with miniaturized 1-chips, reduced number of processes, and improved yield, by a method wherein cutting marks are pressed on a substrate at the same time with the process of forming via-holes. CONSTITUTION:After polishing a semi-insulation GaAs substrate provided with microwave monolithic circuits including the FET structure, via-holes 5 are formed in position, and at the same time cutting marks 7 are formed. The substrate can be acurately cut at a cutting position 6 by fitting the blade of a cutter to the marks 7. The back-view of a 1-chip on the GaAs substrate before cutting shows uneven arrangements of cutting marks 14 at the points of intersection at desired cutting positions 13 by their formation in the same structural process as that of via-holes 12. Generally a plurality of chips are surfaced on a piece of GaAs substrate.Therefore, the marks 14 are very clear because of continuous arrangement on the substrate back as shown by broken lines, and cutting can be easily performed.</p> |
