| 摘要 |
PURPOSE:To enable the opening of IC packages without applying an excessive force to the IC chip in a package, by a method wherein the package is opened with an opening blade while its bottom and side are supported. CONSTITUTION:A slide base table 4 is fixed by tightening a bolt 5, and the bottom of the IC package 10 is supported with supporting tables 2', 4'. Next, a side-fixing table 3 is moved horizontally and brought into contact with the side of the IC package 10, then fixed with a bolt 1. On the other hand, a package-opening blade table 8 is moved by adjusting an up-down adjustment bolt 9 for said table 8 and a horizontal movement bolt 6 for the package-opening blade 7,thus making adjustments so that the tip level of the blade 7 may be coincident with the sealing joint of the boundary between the glass of the glass- sealed package 10 and the ceramic on top of the case. After adjustment of each part, the IC package 10 is opened with the package-opening blade 7 along the sealing joint while the opening-blade table 8 is finely moved by moving the horizontal movement bolt 6 for the blade 7 little by little. |
