| 摘要 |
PURPOSE:To enable the package with a built-in element to be accurately mounted in position on another substrate by a method wherein positioning holes are provided on the packageside. CONSTITUTION:This ceramic package 4 is the in-line type package having a solid-state image pickup element mounted on a ceramic base 5, which is covered with a clear glass cap 6, and leads 7 on both sides of the ceramic base 5. The package 4 is provided with a positioning plate 9 having positioning holes 8a, 8b, whereas the component-mounting substrate 2 with positioning pins 10a, 10b at required positions. Then, the package 4 is mounted to the substrate 2 by fitting the holes 8a, 8b to these pins 10a, 10b. At the time of mounting the package 4 on the substrate 2, accurate positioning can be easily made by insertion to the positioning pins 10a, 10b. |
