发明名称 |
High hardness sintered compact and process for producing the same. |
摘要 |
<p>@ Herein is disclosed a high hardness sintered diamond compact and a process for the production of the same.</p><p>The high hardness sintered diamond compact comprises 80 to 95% by volume of diamond particles, 0.5 to 5% by volume of a carbide particles selected from a group consisting of WC and (MoW)C and having a diameter not larger than 1 micron, and 4.5 to 15% by volume of an iron group metal, at least 95% by volume of said diamond particles having a diameter from 0.1 to 2 micron and the remainder of the diamond particles being particles having a diameter smaller than 0.1 micron.</p><p>The ratio by volume of the amount of the diamond particles having a diameter from 1 to 2 micron to that of the diamond particles having a diameter from 0.1 to 1 micron ranges from 4 to 1.</p><p>The high hardness sintered diamond compact according to the present invention is preferably usable as a drawing die for drawing a high hardness plated-steel wire and as a tool bit.</p><p>The process according to the invention, comprises the steps of:
<UnorderedLists id="ula01" listStyle="none"><ListItem>preparing a diamond powder having a particle diameter distribution from 0.2 to 2 micron;</ListItem><ListItem>mixing the diamond powder with an iron group metal and one member selected from the group consisting of WC and (Mo,W)C powders each having a particle diameter not larger than 1 micron;</ListItem><ListItem>hot-pressing the thus obtained mixture of powders at an ultra-high pressure and a high temperature where diamond may be stable.</ListItem></UnorderedLists></p> |
申请公布号 |
EP0181979(A1) |
申请公布日期 |
1986.05.28 |
申请号 |
EP19840308074 |
申请日期 |
1984.11.21 |
申请人 |
SUMITOMO ELECTRIC INDUSTRIES LIMITED |
发明人 |
NAKAI, TETSUO;YAZU, SYUZI;ASAI, KEIZO;KUMAZAWA, YOSHIAKI |
分类号 |
B01J3/06;C22C26/00;(IPC1-7):C22C26/00 |
主分类号 |
B01J3/06 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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