| 发明名称 |
A method of depositing a copper pattern on a substrate. |
| 摘要 |
<p>In a method of electrolessly depositing copper on a substrate, a palladium seed pattern is formed by directing light (eg from a laser) at the substrate in the presence of the vapour of a palladium compound, such as palladium (II) bis-(hexafluoroacetylacetonate). The substrate may be first coated with a polymer which is removed by excimer laser irradiation.</p> |
| 申请公布号 |
EP0182193(A2) |
申请公布日期 |
1986.05.28 |
| 申请号 |
EP19850114052 |
申请日期 |
1985.11.05 |
| 申请人 |
INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
BAUM, THOMAS HALL;HOULE, FRANCES ANNE;JONES, CAROL RUTH;KOVAC, CAROLINE ANN |
| 分类号 |
C23C18/16;C23C18/18;C23C18/20;C23C18/30;C23C18/31;H05K3/18;(IPC1-7):C23C18/16 |
主分类号 |
C23C18/16 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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