| 摘要 |
A method for manufacturing a circuit board with through hole, by taking the processing steps of: forming a preferred wire distribution pattern by selectively etching the two-side copper-clad laminate; piercing holes to be used as the through holes at the specified locations; masking the surface of the board except the through hole portion by using the conductive ink and the pH-resistant ink; forming the conductive film over the through hole by the electroless plating; forming the metal foil with appropriate thickness over the conductive film by the electroplating, by using the conductive ink layer as the electrode at one end; and finally, removing the conductive ink and the pH-resistant ink. |
