发明名称 |
Package for electronic device and method for producing same |
摘要 |
A package having an enclosure for accommodating an electronic device, and the process of producing same. The process comprises the steps of providing a lead frame which has at least a final layer electroplated on the outerlead area thereof; bonding an electronic device in the enclosure; connecting the electronic device with an innerlead area of the lead frame by means of wires; and, thereafter, sealing the enclosure with fused glass in such a manner that the outerlead area extends out of the glass. |
申请公布号 |
US4590672(A) |
申请公布日期 |
1986.05.27 |
申请号 |
US19820400013 |
申请日期 |
1982.07.20 |
申请人 |
FUJITSU LIMITED |
发明人 |
SHIMIZU, SHOKICHI;AOKI, HIDEJI;KIDA, SUSUMU;KANAZAWA, YUKI |
分类号 |
H01L23/02;H01L21/50;H01L23/057;H01L23/495;H01L23/50;(IPC1-7):H01R43/00;H01L23/48 |
主分类号 |
H01L23/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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