| 摘要 |
<p>PURPOSE:To stabilize an integrated circuit and improve performance thereof by constituting a foundation metal for metallizing as a resistance element. CONSTITUTION:A foundation metal (such as Cr, NiCr, etc.) is evaporated onto an alumina substrate 10 to form a foundation metallic film 14. A conductor film 15 and the foundation metallic film 14 are etched. The conductor film 15 is etched according to a predetermined pattern to shape a resistance element 7. Consequently, a resistor is prepared by the foundation metal, thus transmitting signals without generating the imbalance of characteristic impedance by small transmission loss. When manufacturing a thick-film substrate, the foundation metal is printed on the alumina substrate 10 to shape the foundation metallic film 14, processes in which patterning and baking are added are replaced with a first process, and the same process as mentioned above is conducted.</p> |
