| 摘要 |
PURPOSE:To obtain a low-cost and highly reliable position detecting device for semiconductor pellet by a method wherein the isolated part on one side of the isolated parts of each pellet according to dicing is scanned with a laser beam and the position of the pellet is detected by detecting the other isolated part, which orthogonally intersects the isolated part on one side, in the other direction. CONSTITUTION:A fine laser beam from the He-Ne laser is irradiated on a pellet 5 on an X-Y table 10 via a filter 2, a mirror 3 and a lens 4 and the reflected light is made to incide in a light-receiving element 7. The X-Y table 10 is made to shift in the X direction and when the vinicity of a position 23 on the lateral groove to enable the pellet to isolate into chips is scanned with a laser spotlight, a straight line-shaped pattern is generated, but when a point 24 of intersection of the longitudinal groove and the lateral groove is irradiated with a laser spotlight, a cross-shaped pattern appears. Accordingly, the position of the pellet 5 is exatly detected. |
