| 摘要 |
PURPOSE:To make it possible to automate wire bonding with different planes, by performing position recognition among connections between internal leads and an electronic part and position recognition among connections between the internal leads and external leads, at different terms. CONSTITUTION:Since connections between a group of bondings of an electronic part, for example an integrated circuit, and a group of internal leads of a print circuit substrate are positioned on the same plane on the print circuit substrate, they are handled as a first wire bonding process group. Connections between the group of the internal leads and a group of external leads are done as a second wire bonding process group, since they are positioned on a plane being different from the first wire bonding process group. After either of the first and second wire bonding process groups are earlier finished, the other wire bonding group are carried out. |
