| 摘要 |
PURPOSE:To prevent the bonding pad and the wiring to be performed on the bonding pad from being corroded due to water content by a method wherein the bonding wire is connected to the bonding pad on the semiconductor substrate through a window, which is provided on the surface stabilizing film to cover the bonding pad, in such a way that the window part is compactly covered with the bonding wire. CONSTITUTION:A bonding pad 3 is provided on a semiconductor substrate 1 through an insulating film 2 and a bonding wire 5 is bonded to the bonding pad 3 through the window to be provided on a surface stabilizing film 4 to cover the bonding pad 3. This whole window is covered with the bonding wire 5 and is sealed with a resin 6. As the window is covered with the bonding wire 5, water content does never reach the bonding pad 3. As a result, corrosion of the bonding pad 3 and the wiring 5 is prevented. |
