| 摘要 |
PURPOSE:To contrive the improvement of the cutting processability of the titled wiring plate by a method wherein resin layers having a good cutting property are formed on the joint side of the insulating plate with a conductive plate. CONSTITUTION:An insulating plate 11 is constituted of a glass mat substrate part 11a, which is let a mechanical strength have, and tetron substrate parts 11b having a good cutting processability. Copper plates 12 are junctioned onto the faces of the substrates 11b and the insulating plate is used as the wiring plate. As the substrates 11b are members having a good cutting property, the cutting of the substrates are easy and the finish is also good. |
