| 摘要 |
PURPOSE:To make it feasible to laser cut a circuit wiring part corresponding to any defective part by a method wherein a wiring window is preliminarily formed on a shading conductive film corresponding to a wiring part subject to the most probability of laser cut. CONSTITUTION:An N type photosensitive region 12 is formed on the surface of P type semiconductor substrate 11 while a wiring pattern 15 is formed on the peripheral part of region 12. Then a shading conductive film 21 is formed on the peripheral part of photosensitive region 12 through the intermediary of an insulating film to cover the region whereon a circuit element and the wiring pattern 15 are formed. Within the shading conductive film 21, an extremely fine wiring window 22 having no unfavorable effect upon image pickup characteristics is preliminarily formed corresponding to a part 15a of wiring pattern 15 subject to the most probability of laser cut, in other words, the part 15a connected to e.g. a wiring element subject to the most probable defect. When a defect is analyzed in such an image pick-up device, the wiring part 15a corresponding to any defective part may be easily cut off by laser beams through the intermediary of wiring window 22. |
