| 摘要 |
PURPOSE:To improve bondability remarkably by a method wherein the space located between a metal wire and the member to be joined together is turned into an inert gas atmosphere before a coupling work is performed, and a high voltage is applied between the metal wire and the member to be coupled and they are joined together by generating an arc so that the metal wire is turned to the anode. CONSTITUTION:The part to be joined together on one end side of a copper wire 6 is provided above the surface to be joined together of a copper alloy lead terminal 4. Then, argon gas, which is inert gas, is blown out from a nozzle 10, the space located between the copper wire 6 to be joined together and a copper alloy lead terminal 4 is turned to an inert gas atmosphere, and then a dielectric breakdown is conducted and an arc 9 is generated by applying a high voltage of 1.0kV between the copper wire 6 and the copper alloy lead terminal 4 from a power source 8. Subsequently, using a capillary chip 5, the copper wire 6 is stitch-bonded on the surface where the copper wire is joined to the copper alloy lead terminal 4 by performing thermo-press welding cojointly using ultrasonic waves. At this time, as the surface to be jointed of the copper alloy lead terminal 4 has no oxide coating with which bondability is deteriorated, the copper wire 6 can be firmly joined together. |
