| 摘要 |
PURPOSE:To enable a multilayer wiring section having high reliability and a low cost to be manufactured by carrying out connections of the first and second lead wire groups with wire bondings. CONSTITUTION:A multilayer wiring section produced in such a manner that a glass epoxy print substrate 12 with an upper layer wiring group 11 being formed on an upper surface thereof is prepared separately, and this glass epoxy print substrate 12 is bonded and fixed on an upper surface of alumina ceramics substrate 1 which is the first insulation substrate, with a position being adjusted to the lower layer wiring group 8 which consists of a thin film having a L- shaped form and being piled thereon. The multilayer wiring section is manufactured by a wire bonding of a connection between the first lead wire group 8 and second lead wire group 11 through an opening 13 when a driving circuit element group 10 is wire bonded, then a thermal printing head is completed. |
