| 摘要 |
PURPOSE:To provide the titled composition of high heat resistance, storage stability and solubility, useful for laminating material, conductive paste, heat- resistant adhesive, powder coating, etc., comprising a specific phenyl maleimide derivative, polyepoxy compound and curing catalyst in a specific proportion. CONSTITUTION:The objective composition comprising (A) 10-150pts.wt. of a phenyl maleimide derivative of formula I (n is 0-1; R is H, 1-12C alkyl or halogen), (B) 100pts.wt. of a polyepoxy compound having at least two epoxy groups in one molecule and (C) 0.5-5pts.wt. of a curing catalyst (e.g., tetramethyl ammonium chloride). The component (A) can be prepared by the reaction between an aromatic amine compound of formula II and maleic anhydride in such amounts as to be 1mol of the latter per equivalent of the amino group in the former.
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