发明名称 |
SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE INCLUDING A MASTER SLICE AND METHOD OF MAKING THE SAME |
摘要 |
A semiconductor integrated circuit device includes basic semiconductor elements arranged regularly in lines and rows and located at intersecting points of the lines and rows and wiring conductor layers arranged among the basic semiconductor elements regularly in lines and rows. In this semiconductor integrated circuit device, according to a desired logic operation, wiring conductor layers are cut or contact holes are formed on the wiring conductor layers to form wiring metal layers and connect the basic semiconductor elements to one another, so that an integrated circuit chip capable of performing the desired logic operation is obtained. |
申请公布号 |
DE3071550(D1) |
申请公布日期 |
1986.05.22 |
申请号 |
DE19803071550 |
申请日期 |
1980.07.30 |
申请人 |
FUJITSU LIMITED |
发明人 |
SUGIURA, YOSHIHIDE;ICHIKAWA, HIROAKI;MATSUMURA, NOBUTAKE;SASAKI, NOBUO |
分类号 |
H01L27/092;H01L21/82;H01L21/8238;H01L23/525;H01L23/535;H01L27/118;H01L27/12;H01L29/78;H01L29/786;(IPC1-7):H01L23/52 |
主分类号 |
H01L27/092 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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