发明名称 PROCESS FOR ENCAPSULATING MICROELECTRONIC CIRCUITS WITH ORGANIC COMPONENTS
摘要 <p>Incorporation of special absorbers (getters) in hermetically sealed electronic circuits with organic components for example with parylene passivation, silver conductive adhesive and sealing materials. The getter material, preferably BaAl4 is dispersed as an extremely fine-grained powder in a gas-permeable inert silicon rubber (G) having a composition which varies according to the application. In short or long-term thermal loading for example in hybrids systems the proposed getters make it possible to intercept the corrosive fission products created such as CO CO2, NO/NO2, and water of reaction, and avoid premature ageing.</p>
申请公布号 WO1986003056(A1) 申请公布日期 1986.05.22
申请号 DE1985000473 申请日期 1985.11.18
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