| 摘要 |
<p>PURPOSE:To enable the title device to be used as the non-defective without being cast away if at least one circuit which acts properly is present in a chip, by a method wherein circuits which act properly are wire-bonded to each other in the IC device with the arrangement of a plurality of semiconductor ICs having the I/O sections in a chip. CONSTITUTION:The semiconductor IC device 15 contains semiconductor ICs 8-1 having I/O sections capable of action even by single. After electric characteristic test for every circuit, circuits 8, 9 judged as defective circuits because of the proper action of e.g. circuits 10, 11 as its result are kept marked with defective marks 13, 14 with laser spots or the like. When the circuits 10 and 11 which act properly are connected to each other with bonding wires 16, said device 15 completes. As a result, if a circuit is e.g. the 256kbit RAM, it can be used as the 2X256kbit RAM.</p> |
